Rigid 2Layer black Solder Mask PCB 0.1mm Trace Spacing IC Substrates SD card without BT Materials

Product Description:

The IC Substrate PCB, also known as the Printed Circuit Board for ICs, is a critical component in the realm of electronic devices. It serves as a foundational platform that interconnects the integrated circuit (IC) with the other components of a system. Designed to meet the needs of advanced electronic assemblies, these microchip substrate boards are engineered with precision to ensure high-performance and reliability in various applications, including processor platform PCBs, consumer electronics, automotive modules, and communication devices.

Our IC Substrate PCBs are made from high-quality ceramic materials, which are known for their excellent electrical insulation, high thermal conductivity, and robust mechanical strength. Ceramic substrates are preferred in high-frequency applications due to their low dielectric loss and stability under thermal stress. This makes them ideal for use in environments where the PCB is expected to withstand high temperatures and provide a stable electrical performance over time.

The IC Substrate PCBs come with a standard solder mask color of green. The solder mask is a protective layer that helps to prevent solder bridges from forming between closely spaced solder pads. Green is the traditional color for PCBs as it allows for clear visibility of the traces and pads during inspection, and it is widely recognized for its ability to reduce eye strain for technicians working on the assembly and inspection of these boards.

A high-quality surface finish is crucial for the longevity and reliability of the solder joints on the PCB. Our IC Substrate PCBs feature an Electroless Nickel Immersion Gold (ENIG) surface finish, which provides a flat and conductive surface that is highly resistant to oxidation. ENIG is a two-layer metallic coating – nickel is the barrier to the copper and is the surface to which the components are soldered, while gold protects the nickel during storage and provides a low contact resistance when the components are soldered to the PCB. This finish is particularly favored for its excellent solderability, long shelf life, and its robust performance in corrosive environments.

In terms of physical characteristics, these microchip substrate boards have been meticulously crafted with a thickness of 0.2mm, allowing for a slim profile that is beneficial in compact electronic devices where space is at a premium. The thinness of the substrate does not compromise the board's integrity, as the ceramic material provides sufficient rigidity and durability to support the electronic components mounted on it. Additionally, the slim nature of these PCBs enables better thermal management, which is critical for maintaining the performance and lifespan of the ICs.

Environmental compliance is a key factor in the production of modern electronics. Our IC Substrate PCBs are RoHS compliant, meaning they are manufactured without the use of restricted hazardous substances such as lead, mercury, cadmium, hexavalent chromium, PBB, and PBDE. Adhering to the RoHS directive is not only beneficial for the environment but also ensures that the products can be sold in global markets that enforce such regulations. Consumers and manufacturers alike can be confident that our PCBs meet the highest standards of environmental safety and sustainability.

In summary, the IC Substrate PCBs are a testament to our commitment to quality, performance, and environmental responsibility. With their ceramic construction, green solder mask, ENIG surface finish, slim 0.2mm profile, and RoHS compliance, these printed circuit boards for ICs are poised to deliver exceptional functionality and reliability for a wide range of electronic applications. Whether used in processor platform PCBs, consumer electronics, or sophisticated communication systems, our microchip substrate boards are engineered to meet the stringent demands of today's advanced electronic devices.

Features:

• Product Name: IC Substrate PCBs
• Minimum Trace Width: 0.1mm
• Lead Time: 2 Weeks
• Solder Mask Color: Green
• Rohs Compliant: Yes
• Minimum Trace Spacing: 0.1mm
• Application: Electronic Circuit Interconnects
• Usage: Embedded System Circuit Boards
• Features: Microelectronics Circuit Layers

Technical Parameters:

Applications:

IC Substrate PCBs (Printed Circuit Boards) are specialized electronic circuit interconnects designed to offer a stable and reliable platform for mounting and interconnecting various electronic components. These boards are commonly utilized as computer chip substrate panels, offering a critical link between microchips and other electronic devices. With a surface finish of Electroless Nickel Immersion Gold (ENIG), these PCBs provide excellent surface planarity and oxidation resistance, which is essential for ensuring the long-term reliability of solder joints in sensitive electronic applications.

The copper weight of 1oz in these IC substrate PCBs is indicative of the copper thickness, which is essential for determining the current-carrying capacity of the traces. This, in combination with a minimum trace spacing of 0.1mm, allows for high-density interconnects that are crucial in modern electronic devices where space is at a premium and functionality cannot be compromised. This fine trace spacing also enables the creation of intricate patterns needed to connect modern high-pin-count chips to their destinations.

IC substrate PCBs with these specifications are often found in applications requiring high precision and reliability, such as in advanced computing systems, smartphones, tablets, and other portable devices. These computer chip substrate panels are also integral to the aerospace, medical, and automotive industries, where they are used in sensors, control units, and communication equipment. The 0.2mm thickness of the substrate provides a slim profile that is highly desirable for compact electronic assemblies, allowing for sleeker device designs without sacrificing performance.

With a lead time of just 2 weeks, these IC substrate PCBs are able to meet the demands of rapid product development cycles, which is a significant advantage in industries where time-to-market is a critical factor. This quick turnaround time ensures that designers and engineers can iterate through design changes swiftly, allowing for faster prototyping and ultimately quicker deployment of final products.

In summary, the IC Substrate PCBs with ENIG surface finish, 1oz copper weight, 0.1mm minimum trace spacing, 2-week lead time, and 0.2mm thickness are ideal for a variety of high-performance applications where quality electronic circuit interconnects are paramount. These computer chip substrate panels are engineered to meet the exacting standards required by today's sophisticated electronic components and the industries that rely on them.

Customization:

Our IC Substrate PCBs are designed to cater to high-performance chip board assemblies, ensuring reliability and efficiency for your processor platform PCBs. With a maximum operating temperature of 150°C, these printed circuit boards for ICs are built to withstand rigorous operational conditions.

This product features a standard 2-layer structure, providing a solid foundation for a variety of electronic applications. The compact size of 10mm X 10mm makes it ideal for space-constrained designs without compromising on functionality.

To ensure durability and longevity, each board is coated with a green solder mask, offering protection against environmental factors while maintaining excellent solderability. The surface finish employs ENIG (Electroless Nickel Immersion Gold), known for its excellent conductivity and resistance to oxidation, which is crucial for maintaining a reliable interconnection between the IC substrate and the electronic components.

Support and Services:

Our Product Technical Support and Services for IC Substrate PCBs are designed to ensure the highest level of performance and reliability for your critical applications. Our team of expert engineers is dedicated to providing comprehensive support throughout the product lifecycle, from initial design and prototyping to full-scale production and end-of-life management.

Our services include advanced design consultation to help optimize your IC Substrate PCB for your specific needs, ensuring signal integrity, power distribution, and thermal management are all addressed with precision. We also offer material selection guidance to balance performance requirements with cost considerations, providing you with the most effective solutions for your projects.

We conduct rigorous testing and quality assurance processes to guarantee that your IC Substrate PCBs meet all industry standards and regulatory requirements. Our testing services include electrical testing, thermal analysis, and mechanical stress testing to identify potential issues before they can impact your operations.

In the event of performance concerns or technical challenges, our responsive technical support team is here to assist you with troubleshooting and problem-solving. We strive to provide timely and effective solutions to keep your systems running smoothly and minimize any downtime.

To ensure your team is fully equipped to handle the IC Substrate PCBs, we offer comprehensive training services covering installation, operation, and maintenance best practices. Our goal is to empower your team with the knowledge and skills necessary to achieve optimal performance from your IC Substrate PCBs.

For customers looking to extend the life of their products or manage end-of-life transitions, we provide support with upgrade paths and redesign services. This allows for continuous improvement and adaptation to emerging technologies, ensuring your investment in IC Substrate PCBs remains relevant and valuable over time.

We are committed to delivering exceptional support and services for your IC Substrate PCBs, helping you to achieve success in your high-tech endeavors. Our team is ready to assist you with any technical needs that may arise, ensuring you get the most out of your products.