Categories | USB Flash Chip |
---|---|
Brand Name: | JINFLY |
Model Number: | PCBA02 |
Certification: | CE ROHS FCC EMC UKCA REACH |
Place of Origin: | CHINA |
MOQ: | 50 |
Price: | USD 0.7-26.8 |
Payment Terms: | L/C, T/T, Western Union, MoneyGram, D/P, D/A |
Supply Ability: | 54000000pcs/Year |
Delivery Time: | 7 days |
Packaging Details: | Bulk tray pacakge |
Product name: | Otg 2.0 3.0 Usb Flash Drive Chip 2 In 1 Usb Flash Drive PCBA Chip 512MB 1GB 2GB 4GB 8GB 16GB 32GB 64GB 128GB |
Chip: | A-class Flash Chip |
Capacity: | 8GB/16GB/32GB/64GB/128GB/256GB |
Type: | PCBA2.0 3.0/PCBA USB/PCBA3.0+Type C/PCBA3.0+OTG |
Reading Speed: | 50-120MB/S |
Format: | FAT32 (128MB-32G) / EX-FAT (64GB-256GB) |
Functions: | Data Storage, Storage Carrier |
OEM ODM: | YES |
Application: | Promotion\Business\School\Office |
Size: | L x W x H: 59 x 19 x 10mm |
New Sales Method: Usb Flash Chip And Outer Casing Realize Separate Packaging, Sales And Delivery
2.0 3.0 Usb Flash Drive Chip 2 In 1 USB OTG Chip PCBA Chip 8GB 16GB 32GB 64GB 128GB
Otg 2.0 3.0 Usb Flash Drive Chip 2 In 1 Usb Flash Drive PCBA Chip 8GB 16GB 32GB 64GB 128GB
Technical requirement for PCB&PCBA assembly:
Ø Professional Surface-mounting and Through-hole soldering
Technology
Ø Various sizes like 1206,0805,0603 components SMT technology
Ø ICT(In Circuit Test),FCT(Functional Circuit Test) technology.
Ø Nitrogen gas re-flow soldering technology for SMT.
Ø High Standard SMT&Solder Assembly Line
Ø High density interconnected board placement technology capacity.
Quote requirement for PCB&PCBA assembly:
Ø Gerber file and Bom list
Ø Clear pics of PCBA or PCB sample for us
Ø Test method for PCBA
Ø Quality control syste
* PCBA Development,R&D Solutions
* Embedded Memory Chip Factory Direct Price
* Support marketing materials(including HD main images, detail pages, videos, etc.)
FAQ:
1. Are you factory?
Yes, we are leading factory for 15+ years. JINFLY(jingfeng) is a specialized and special new high-tech enterprise focusing on innovative product solutions for semiconductor memory and advanced packaging and testing services for professional integrated circuits.
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