| Categories | ED Copper Foil |
|---|---|
| Brand Name: | JIMA |
| Model Number: | EDCU |
| Certification: | SGS, ISO,Reach, RoHS |
| Place of Origin: | china |
| MOQ: | negotiation |
| Price: | negotiation |
| Payment Terms: | T/T, L/C |
| Supply Ability: | 9000 Ton per month |
| Delivery Time: | 5-15 days |
| Packaging Details: | Wooden carton |
| Purity: | 99.9% |
| Anti oxidation: | 180 degree 60 minutes, 180 days 23 degree |
| Thickness: | 25um，0.025mm |
| Length Per Roll: | 500 - 5000 Meter |
| Inter Diameter: | 76 Mm |
| Name: | 0.025mm Thick ED Copper Foil , Copper Foil 25 micron |
0.025mm Thick ED Copper Foil , Copper Foil 25 micron
good flatness close to 100%, without stress or others that can influence the production
JIMA has 20 years experience in copper foil industry, more than 27000 tons output yearly to meet the rising market requirement. In PCB, battery and shielding field, our copper foil leads the market as a material supplier. High quality product and sincere service is our fundamental to be existence and developing.
| Product name | ED Copper Foil 25 Micron, Insulated Copper Foil 0.025mm Thick |
| Copper foil thickness | 25um,0.025mm |
| Copper type | ED Copper Foil for PCB, Li-ion Battery, MRI Room sheilding copper foil ,Insulated |
| Copper content | ≥ 99.9% |
| Certification | ISO 9001:2008, IPC-4562, RoHS |
| MOQ | One roll |
| Cut roll width | Customized |
| Coil length and weight | on request |
| Characteristics | High Temperature Elongation, Fine and Uniform Crystal Structure |
| Payment Term | T/T in advance, Western Union, L/C |
| Flatness | good flatness close to 100%, without stress or others that can influence the production |
| Application | transformer, PCB, battery, precisio |
ED Copper Foil Typical Properties
Classification | Unit | Requirement | Test Method | |||||
| Foil Designation | / | H | M | 1 | IPC-4562A | |||
| Nominal thickness | / | 1/2 OZ | 3/4 OZ | 1 OZ | IPC-4562A | |||
| Area Weight | g/㎡ | 150±5 | 228±8 | 285±10 | IPC-TM-650 2.2.12.2 | |||
| Purity | ％ | ≥99.8 | IPC-TM-650 2.3.15 | |||||
| Foil Profile | Shiny side (Ra) | սm | ≤0.4 | ≤0.4 | ≤0.4 | IPC-TM-650 2.3.17 | ||
| Matte side(Rz) | um | ≤8 | ≤10 | ≤12 | ||||
| Tensile Strength | R.T.(23℃) | Mpa | ≥220 | ≥235 | ≥280 | IPC-TM-650 2.3.18 | ||
| Elongation | R.T.(23℃) | ％ | ≥2 | ≥3 | ≥3 | IPC-TM-650 2.3.18 | ||
| Peel Strength(FR-4) | CEM-1 | N/mm | ≥1.5 | ≥1.7 | ≥2.0 | IPC-TM-650 2.4.8 | ||
| PTC | ≥0.5 | ≥0.6 | ≥0.8 | |||||
| Pinholes&porosity | Number | No | IPC-TM-650 2.1.2 | |||||
| Anti-oxidization | R.T.(23℃) | day | 180 or customize | / | ||||
| H.T.(200℃) | Minutes | 60 or customize | / | |||||
Copper Feature
1. Lightweight
2. Installed in more MRI Sites Worldwide than any other shield
system.
3. Can be used with either a monolithic RF Floor (moisture
resistance) or a modular RF Floor.
4. Copper Serves as an eddy current shield for EMI Protection
The Production Flow :
Copper Foil Photos
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Low Profile Electrolytic Copper Foil Black Treatment 105um 70um 50um 35um 25um 12um 9um
99.8% Purity 35um Hvlp Copper Foil for FCCL / FPC Application
0.025mm Thick ED Copper Foil , Copper Foil 25 micron
3 / 4 OZ Rolled Copper Foil , Copper Foil Paper For IC Package Substrates
High Coarse Edco Copper Foil 5mm Width Circuit Board Copper Foil Sheet
3 / 4 OZ ED Copper Foil Flexible Copper Clad Laminate Good Folding Endurance
12um 18um 25um 35um ED Copper Foils For FPC Materials / EMI
Red Low Profile ED Copper Foil 15um 18um 35um Used For Samsung Phone Heat Sink
1 OZ ED Copper Foil For Special Conductivity Material Red / Black Color
70um Electrolytic ED Copper Foil Good Etch Ability Max 1380mm Width
